Industry News | 2009-04-09 22:35:29.0
The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.
Industry News | 2014-02-21 12:50:41.0
Kyzen today announced that Mike Bixenman, DBA, CTO, and David Lober will present at five separate technical sessions at IPC APEX EXPO in Las Vegas in March.
Industry News | 2016-05-21 07:36:35.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2021-10-11 16:06:46.0
KIC will exhibit in Hall A2, Stand 316 at productronica, scheduled to take place 16-19 November 2021 at the Messe München in Germany. KIC are thermal process experts who make ovens smarter. Along with Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking, and their complete ecosystem of solutions for thermal processes.
Industry News | 2016-06-05 13:20:49.0
SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.
Industry News | 2011-08-08 16:00:11.0
KIC will hold a seminar in Brazil titled “Soldering Challenges” on Tuesday, August 16 and Thursday, August 18, 2011. The Tuesday seminar will take place at the Holiday Inn in Manaus, AM, and the Thursday seminar will take place at the Royal Palm Plaza in Campinas, SP.
Industry News | 2021-12-21 15:06:19.0
KIC will exhibit in booth 3009 and the Factory of the Future Pavilion at the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022, at the San Diego Convention Center San Diego, CA. The KIC team are thermal process experts who make ovens smarter. Along with award-winning Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking and their complete ecosystem of solutions for thermal processes.
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
Application Field SMT/PCBA Package type：BGA、LGA、CSP、POP、SIP... Defect type：Void、HIP、Insufficient、Bridge... Semiconductor Package type：W/B、IC、F/C... Defect type：Void、Open、Short、Sweep、Solder ball... Other areas
Technical Library | 2015-07-14 13:19:10.0
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.
