Electronics Forum: vacuum reflow (Page 7 of 14)

Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 07:46:26 EDT 1998 | Peter H. Cote

We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C

Vacuum Bake out of plastic BGAs

Electronics Forum | Mon Jan 10 16:14:17 EST 2005 | fmonette

Hi Gary, With plastic BGAs it is more difficult to remove the trapped moisture because of ground planes in the substrate. If your parts have been sitting around for a long time they may be soaked with moisture and in some cases the 48 hours bake cy

MPM UP2000 Hi-e

Electronics Forum | Tue Aug 29 10:36:09 EDT 2006 | Chunks

With the UP2000 that has vacuum board hold down, the Grid Loc hoses defeat the vacuum in order for them to exit the work table. Big boards require more girds, thus more hoses. Set-up between large and small boards takes time to remove or add the gr

SMT Exhaust Vacuum Monitor

Electronics Forum | Thu Feb 07 12:18:41 EST 2008 | tonyamenson

Does anyone use or have any simple wave/reflow oven exhaust monitors with a visual check (LED). I was going to design something crude resembling a fan with an electric winding (electric motor of sorts)and a load (resistor maybe with a transistor if

Re: BGA ball missing.

Electronics Forum | Sun Aug 30 16:36:31 EDT 1998 | Steve Gregory

Hi Kc! I went to Surface Mount International last week, and had a chance to see a way to reball BGA's that is very simple, and not expensive at all. I've seen the advertisements in a few magazines, but this was the first time I've seen it live. It's

Re: glop top popcorn

Electronics Forum | Wed Jun 23 11:02:09 EDT 1999 | John Thorup

| | We are reflowing boards that have glop top components | mounted on them. Do glop tops have the same moisture | sensitivity as fine pitch? Should we be baking the boards | prior to reflow? | |If your glob tops are PBGAs, they are likely very mo

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 12:19:53 EDT 1998 | Earl Moon

| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 15:49:05 EDT 1998 | Earl Moon

| | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg

Support Fixtures or Systems

Electronics Forum | Mon Jul 30 10:44:37 EDT 2001 | hinerman

A few of the more common defects If bridging or insuffienct deposits occur on the printer, one of the first things to check is the tooling. Misplaced hard tooling pins or poorly designed fixtures have a nasty habit of breaking components on side

BGA Bowing on the corners.

Electronics Forum | Fri Aug 22 23:17:22 EDT 2003 | Hoss

Mike, Any chance these parts have been sitting around esposed to your factory's ambient conditions, not in a vacuum sealed bag or dry box? If they haven't, you may have parts with a high moisture content which could cause "potato chipping" you desc


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