Industry News | 2015-05-13 13:57:18.0
The current trend of miniaturization in microelectronics have paved the way for 3D packaging; allowing for lower manufacturing cost, increased memory and speed and a greater variation in functional uses of the miniaturized devices.
Industry News | 2022-11-15 12:50:53.0
Nihon Superior Co. Ltd. is pleased to introduce its LF-C2 Lead-Free Solder Paste. Designed for automotive applications, LF-C2 is the high-strength alloy of choice when cracking minimization is a key selection criterion.
Industry News | 2010-09-24 11:43:04.0
Reflow Oven video providing overview of APS Novastar's Reflow Oven products for lead-free and lead based reflow soldering, curing, and thermal cycling applications.
Industry News | 2013-11-14 18:14:55.0
Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Industry News | 2014-01-31 00:23:23.0
Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.
Industry News | 2017-08-16 11:15:46.0
PDR today announced plans to exhibit at SMTA International. The PDR team will showcase the Evolution Series Rework Systems – including the new PDR IR-E3M Micro Component/PCB Rework System – in Booth #233. Additionally, the new PDR IR-TS One IR Thermal Test System will be available for demos.
Industry News | 2017-04-23 11:18:17.0
PDR, a leader in IR rework, test and inspection, is pleased to announce that Horizon Sales will discuss its new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems at the SMTA Wisconsin Expo & Tech Forum, scheduled to take place Tuesday, May 2, 2017 at the Milwaukee Airport Crowne Plaza in WI. Horizon Sales is PDR’s exclusive representative in the Midwestern U.S.
Industry News | 2014-07-28 15:50:58.0
Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
Industry News | 2018-04-09 10:49:39.0
(Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
Industry News | 2023-12-18 13:13:45.0
SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components.
