Industry News: substrate (Page 7 of 96)

SMTAI 2009 Call For Papers Reminder

Industry News | 2009-01-23 19:18:23.0

You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.

Surface Mount Technology Association (SMTA)

IPC Rolls Out New Printed Electronics Management Council Committee

Industry News | 2011-12-07 20:51:57.0

IPC announces the creation of a new IPC Printed Electronics Management Council Steering Committee that will oversee the development of educational programs to support the printed electronics industry.

Association Connecting Electronics Industries (IPC)

Printed Electronics Coming of Age at IPC APEX EXPO 2012

Industry News | 2012-02-07 00:51:20.0

A key enabling technology that is making a significant impact in consumer, commercial, medical and specialty electronics markets, printed electronics is coming of age at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. IPC APEX EXPO will feature a dedicated printed electronics area on the show floor, a printed electronics track in the technical conference, and historic standards development meetings where the first-ever industry requirements for the manufacture and assembly of printed electronics will be discussed and developed.

Association Connecting Electronics Industries (IPC)

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)

IPC Announces Agenda for Component Technology Conference September Event to Target 3-D and Other Interconnection Solutions

Industry News | 2013-06-20 19:24:42.0

IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.

Association Connecting Electronics Industries (IPC)

IPC and JPCA Release Industry’s First Design Guidelines for Printed Electronics

Industry News | 2013-07-31 07:28:30.0

Today, the electronics manufacturing industry’s first design guidelines for printed electronics, IPC/JPCA-2291, Design Guidelines for Printed Electronics, was released by IPC — Association Connecting Electronics Industries® and JPCA.

Association Connecting Electronics Industries (IPC)

World PCB Market Grew 1.7 Percent in 2012 According to IPC World PCB Production Report

Industry News | 2013-09-17 07:21:08.0

The world market for PCBs reached nearly $60 billion in 2012, with 1.7 percent real growth over 2011, according to IPC’s World PCB Production Report for the Year 2012.

Association Connecting Electronics Industries (IPC)

Count On Tools announces its membership in the Cree Solution Provider Program

Industry News | 2013-10-11 08:17:05.0

Count On Tools Inc. (COT), is pleased to announce that it has been invited to take part in the Cree Solution Provider Program (CSP).

Count On Tools, Inc.

Ventec International Group Receives IPC-4101 Qualified Products Listing Certification

Industry News | 2017-11-13 13:38:37.0

IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Ventec International Group, a global electronics material manufacturing company headquartered in Suzhou, China.

Association Connecting Electronics Industries (IPC)

Nordson ASYMTEK's Helios™ SD-960 Series Automated Dispensing System dispenses medium and bulk volume deposits of single- (1K) and two-component (2K) fluids and supports highly abrasive

Industry News | 2018-03-22 21:11:24.0

Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.

ASYMTEK Products | Nordson Electronics Solutions


substrate searches for Companies, Equipment, Machines, Suppliers & Information