New Equipment | Cleaning Agents
239°F / 115°C Water Soluble: Complete VOC, @ 100% 1034 g/L MICRONOX products are semiconductor grade cleaning chemistries for defluxing and particulate removal for the Advanced Packaging, Microelectronics and Semiconductor industries. Other KYZ
New Equipment | Cleaning Agents
210°F / 99°C Boiling Point: 266°F / 130°C Water Soluble: Complete VOC, @ 10% 90.1 g/L MICRONOX products are semiconductor grade cleaning chemistries for defluxing and particulate removal for the Advanced Packaging, Microelectronics and Semicond
New Equipment | Cleaning Agents
CYBERSOLV 141-R dissolves rosin and low residue flux residues and then readily evaporates after the cleaning application. CYBERSOLV 141-R is designed for bench-top cleaning needs and is ideally suited for cleaning through-hole and SMT electronic asse
Petroferm offers a complete line of aqueous, semi-aqueous, and manual solvent cleaning chemistries for removing raw solder paste and surface mount adhesives from stencils and misprinted boards both by hand and in stencil cleaning equipment. HYDREX A
New Equipment | Cleaning Agents
210°F / >99°C Boiling Point: 282°F / 139°C Water Soluble: Partial VOC, @ 10% 82.4 g/L AQUANOX line of chemistries are concentrated aqueous cleaning chemistries designed for the Electronic Assembly, Aerospace and Automotive industries. Each pro
New Equipment | Cleaning Agents
220°F / 104°C Boiling Point: 280°F / 138°C Water Soluble: Not Soluble VOC, @ 10% 90 g/L AQUANOX line of chemistries are concentrated aqueous cleaning chemistries designed for the Electronic Assembly, Aerospace and Automotive industries. Each p
New Equipment | Cleaning Agents
199°F / 93°C Boiling Point: 291°F / 144°C Water Soluble: Partial VOC, @ 10% 88.5 g/L AQUANOX line of chemistries are concentrated aqueous cleaning chemistries designed for the Electronic Assembly, Aerospace and Automotive industries. Each prod
New Equipment | Cleaning Equipment
Precision Fine Pitch Aperture Cleaners Thousands of dollars less than fully-automatic cleaners Low solvent usage and running costs Fast cleaning time of 1-3 minutes Minimal waste disposal Portable unit can be used directly on the screen printe
New Equipment | Cleaning Agents
MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its
New Equipment | Cleaning Agents
MICRONOX MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues from wafer bumps found in die-attach, flip chip, copper pillar, and emerging semiconductor assemblies. MX2302 is used as received in all
