Electronics Forum: pull test (Page 7 of 24)

defects in pcb manufacturing

Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef

Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated

glue measurement

Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand

Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.

Soldering PTH Card stiffeners

Electronics Forum | Tue Aug 13 12:22:03 EDT 2002 | dragonslayr

A bit of gray area for you. consider the application over the specmanship. Why are the stiffeners there in the first place? Is the rigidity requirement a high function i.e. very necessary due to potential shock and vibration , etc.? The soldering is

Atmel QFP's

Electronics Forum | Thu Dec 06 10:15:14 EST 2007 | 18424

I am looking for people that are having problems primarily with test of their product after reflow/production. Has anyone experienced a great solder joint but the component still fails test? Has anyone had dewetting of atmel components, pull back of

Conformal coating IS-410 boards

Electronics Forum | Sat Apr 21 08:26:57 EDT 2007 | Cmiller

Has anyone experienced a problem with conformal coating adhesion to IS-410 boards? We are having problems with one suppliers boards. IS-410 boards from other suppliers are fine and all FR-4 boards that I have looked at are fine. We are using Conap

Solder Paste Evaluation

Electronics Forum | Thu Jan 12 09:35:09 EST 2006 | ratsalad

That is the document on which I based my Pb-free solder paste evaluation, with some modifications. Here's the full Zarrow PDF: http://www.smtinfocus.com/PDF/Evaluating_solder_paste_zarrow.pdf Also, we're doing a Pb-free vs SnPb comparison. We are

Re: 0603 Components

Electronics Forum | Mon Sep 11 04:23:49 EDT 2000 | Wolfgang Busko

Adam: I would say that you do have a reliability problem. - check parts for solderability - check your board finish - check your profiles - check your paste - check your processes with focus on cleanliness - do some mechanical tests, you should rath

Shear Strength of Tinned Leads

Electronics Forum | Fri Aug 08 12:46:02 EDT 2003 | davef

When I was a salty old fart in the Navy, we sent the babes from the turnip patch off on snipe hunts. Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied

Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Fri Oct 01 10:04:20 EDT 1999 | Andrew William Dalrymple

I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at rewor

Re: BGA and Gold Boards

Electronics Forum | Wed Jun 24 16:23:29 EDT 1998 | Justin Medernach

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, Your concer


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