Electronics Forum | Thu Sep 17 12:00:19 EDT 1998 | Mike C
| | I need an evaluation process to prove to a customer that our no-clean process does not leave excessive residue? Any ideas? | Wayne: More of the same as Chry and Justin. | KEY ISSUE | The first thing that you need to know is: What does your cus
Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef
We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Fri Sep 04 09:51:34 EDT 1998 | Dave F
| | | | | | | | | We�ve been thinking again and need your help in sorting through an issue related to deionized (DI) water cleaning of assembled boards. | | | | | | | | | THE BACKGROUND: The water reclaiming systems goes: gross filter, fine filter,
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
