Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F
Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow
Electronics Forum | Thu Feb 07 09:07:10 EST 2002 | fmonette
Dason, Please be aware that weight gain is only a very crude estimate of the component moisture content. This is only accurate when the moisture is uniformly distributed inside the component (which is actually never). This measurement is usually no
Electronics Forum | Mon Jan 12 13:15:18 EST 1998 | Yves Trudell
In general terms, guidelines for moisture sensitive devices (MSDs) say that you shouldn't put a component through reflow after it has reached its exposure limit with respect to moisture absorption. When using an automated hot air rework tool to remo
Electronics Forum | Tue Nov 28 22:34:55 EST 2006 | davef
Almost all boards are hydroscopic. In this, the epoxy holding the board together absorbs moisture. Almost all components are hydroscopic. In this, the epoxy encapsulating the component together absorbs moisture. So, as you heat the board / compon
Electronics Forum | Tue Apr 23 10:31:59 EDT 2019 | laserpro
Hi all and thanks for viewing my post! My questions related to the subject line are as follows: 1. Does the Epoxy Solder Mask Layer of a PCB protect against moisture absorption? Is this a primary function of the solder mask? 2. Does exposed FR4 na
Electronics Forum | Fri May 21 13:57:02 EDT 1999 | KA Stillings
| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | |
Electronics Forum | Mon Nov 16 08:50:04 EST 1998 | Larry Johnson
I don't really no much of any problems other then, be sure that the BGA avoids moisture. If the BGA has moisture inside of it when it across the wave. Due to the heat, the moisture will evaporate and cause shorts inside the BGA. Now if someone can
Electronics Forum | Wed Aug 11 10:28:20 EDT 2004 | Richard Evans
We currently are supplied parts that are moisture sensitive that have high MOQ's even though product volumes are low. These devices are heat sealed by the manufacturer but we have no method to re-seal the packaging to protect the remaning items from
Electronics Forum | Fri Apr 23 14:27:22 EDT 2010 | hegemon
I am concerned about a 'tarnishing' effect after moisture bake out that affects solderability on a batch of PCBs. This finish is new to us,and I am wondering if anyone has ideas about how to drive the moisture out of the boards without compromising
Electronics Forum | Thu Jun 06 10:08:55 EDT 2013 | grauen06
We keep all moisture sensitive parts in a humidity control enviroment at our main plant, but our return/refurb products building does not have humidity control. My question: Do moisture sensitive ICs that get hand placed by our refurb/return team n
