Industry News | 2012-05-15 11:23:39.0
Tim O’Neill, Northeastern Regional Sales Manager, will present on Lead-Free Alloy Development at the Ohio Valley SMTA Solder Paste Round Table Meeting,
Industry News | 2012-08-01 16:22:42.0
AIMannounces that Luke Chen will present at the upcoming SMTA China South Conference
Industry News | 2018-11-16 15:48:54.0
Viscom announces that it was awarded a 2018 Mexico Technology Award in the category of Inspection Equipment – X-ray for its X7056-II automatic 3D X-ray inspection system. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Industry News | 2022-04-13 09:47:35.0
MacDermid Alpha Electronics Solutions will be participating in the upcoming Global SMT & Packaging panel discussion, "Head-in-Pillow - what causes it, how do you spot it and how do you avoid it?" on April 19 at 10:30 am New York / 3:30 pm London.
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
Our latest innovation in 3D In-Line Advanced X-ray Inspection System (AXI) is designed to specially cater to different sizes of PCB assembly to be examined at micron level with maximum throughput. This translates to increased production efficiency an
New Equipment | Assembly Services
Introduction sales(at)responmoulding(d0t)com We custom produce plastic injection molds and parts for plastic electronics housings and enclosures, such as plastic switch box mold, plastic camera housing mold, plastic phone case mold, plastic powe
Introduction sales(at)responmoulding(d0t)com We custom produce plastic injection molds and parts for plastic electronics housings and enclosures, such as plastic electricity meter box mold, plastic water meter box mold, plastic loud speaker mold, p
Introduction sales(at)responmoulding(d0t)com We custom produce plastic injection molds and parts for plastic electronics housings and enclosures, such as plastic phone case mold, plastic power bank mold, plastic camera housing mold, plastic switc
