Electronics Forum: fine and pitch and printing (Page 7 of 11)

Ekra E5 language change and manual needed

Electronics Forum | Fri Jun 08 09:49:10 EDT 2018 | oriolsancheza

Hello! We've recently bought an Ekra E5 that is actually in German. Managed to get it working fine, but we would like to know how to change the language to English. Is that possible? We also have the full manual printed, but also in German, anyone

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 17:00:34 EDT 2007 | jmelson

Oh, sure, on fine-pitch parts you need a microscope or at least a good magnifier. But, OK, you have some kind of contamination. Solder is one thing, but where are these stainless, aluminum and copper particles coming from? Stainless makes me think

BGA: reworking BGAs, testing and inspection

Electronics Forum | Thu Feb 11 15:07:49 EST 2010 | hegemon

With regards to the rework, size and mass of the PCBs is important, in addition to the size of the components that are to be reworked. You might be in the game with $6K (APE Chipmaster Hot Air machine with Preheater or similar setup) if you have sma

OSP and getting full pad wetting??

Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak

what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal

Fuji CP6 and IP3 specifications request

Electronics Forum | Thu Aug 04 13:58:20 EDT 2016 | sumote

Does anyone have the technical specifications for the Fuji CP6 and the Fuji IP3? Looking for the placement speed (parts per hour), accuracy, smallest/largest component size, fine-pitch (what size it can do). Our new sales guy is putting together some

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

paste release from stencil, and volume calculation

Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas

We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having

Advice on used pick and place machine

Electronics Forum | Mon Oct 09 13:36:30 EDT 2006 | ppminc

Phil, The QSA-30 was built by Sam Sung, Sold by Quad. Single Head 2 Nozzles around 11K CPH Quad does not support the machine but I believe you can get parts direct from Sam Sung. I am not sure if they have a registration fee. The QSA used Quad made

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Fountain Wave Soldering and Repair/Rework Equipment

Electronics Forum | Thu Jan 21 09:27:33 EST 1999 | Earl Moon

Hello, I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all the re


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