Electronics Forum | Thu Jul 05 19:37:15 EDT 2007 | davef
We assume the three leads are lined-up perpendicular to the wave. Without taking corrective action, we know this: * 50 thou pitch will bridge * DIP do not bridge As a corrective action that doesn't invovle a respin of the board, decrease the solderm
Electronics Forum | Mon Dec 30 12:36:20 EST 2019 | emeto
Thanks Rob, this is excelent
Electronics Forum | Tue Dec 31 02:10:54 EST 2019 | sssamw
The video showing wave contact is not consistent and not stable from width size, make it better.
Electronics Forum | Tue Jan 16 20:44:07 EST 2007 | davef
Bridging Causes: Insufficient flux, Excessive pre-heat, High conveyor speed, Solder contamination Look here: * http://www.smtnet.com/library/files/upload/Reflow%20Wave%20Poster.pdf * http://smt.pennnet.com/Articles/Article_Display.cfm?Section=Archi
Electronics Forum | Wed Jan 23 18:15:33 EST 2008 | gsala
Hi, are you dealing with Leaded or Lead Free P-BGA ? soldering by Lead or Lead Free paste ? Any way, some time, bridges can be caused by moisture entrapped in the BGA body. Make sure if is respected the correct MSL's allowed flore exposure time, ot
Electronics Forum | Fri Dec 27 11:42:18 EST 2019 | emeto
I could not see pictures of your board - please attach one or two. So to answer your questions: 1. wave should not overflow over your board - mostly we use pallets as carriers to protect the assembly. 2. Solder dross is caused because your wave is no
Electronics Forum | Fri Dec 27 12:12:29 EST 2019 | slthomas
As has already been mentioned, black residue is usually either from dross or just a dirty pot, pump, baffles, etc.. I also saw that maaaany years ago in a system that used a flawed oil intermix "feature" but hopefully those systems are long gone.
Electronics Forum | Fri Jul 06 15:45:50 EDT 2007 | hussman
I have to agree with the fat green guy. And with Real Chunks too. You should also run a matte mask on your board. This will help in preventing shorts.
Electronics Forum | Thu Jan 17 11:49:54 EST 2008 | wayne123
HI, I have ran into this a time or two, and what I did before we got the BGA rework station was to run some flux under the component, and since the flux that was in the solder on the other solder joints has at least part of the way burned off in the
Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason
I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason
