Industry News | 2020-09-06 04:29:53.0
Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an Avoid the Void® InSIDER Series workshop on how to avoid voiding in bottom termination components (BTCs) on Tuesday, September 22 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).
Industry News | 2015-10-30 15:33:26.0
Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.
Technical Library | 2019-07-24 23:55:32.0
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes.
Industry News | 2023-11-20 13:47:24.0
MacDermid Alpha Electronics Solutions launches ALPHA® OM-362, its latest next-generation low-void solder paste.
Industry News | 2014-05-22 11:36:25.0
Indium Corporation's Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.
Industry News | 2018-11-27 11:48:56.0
Indium Corporation earned the Mexico Technology Award for its Indium10.1HF Solder Paste. The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best electronics manufacturing innovations in the electronics manufacturing industry in Mexico produced by OEM manufacturing equipment and materials suppliers over the last year.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Technical Library | 2017-07-20 15:18:15.0
As electronic devices increase functionality in smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with moisture, there is the potential for ion mobilization causing current leakage.
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
Industry News | 2018-11-14 15:48:25.0
Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at IPC APEX EXPO 2019, Jan. 29-31, in San Diego, California, USA.
