New Equipment | Rework & Repair Equipment
PDR E3M Rework System for Micro SMD Rework is made of only the finest materials and components for Micro- BGA Rework, 0201 Rework, CSP Rework, uBGA Rework, LED Rework, area Array Rework, and similar micro applications. Combining PDR's ThermoActive s
New Equipment | Soldering - Other
http://www.flason-smt.com/product/100g-Solder-Paste-for-BGA-refwork-mobile-phone-repare.html 100g Solder Paste for BGA refwork mobile phone repare 100g Solder Paste BGA refwork Solder Paste mobile phone repare Solder Paste 100g Solder Paste fo
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
New Equipment | Solder Materials
http://www.flason-smt.com/product/100g-Solder-Paste-for-BGA-refwork-mobile-phone-repare.html 100g Solder Paste for BGA refwork mobile phone repare 100g Solder Paste BGA refwork Solder Paste mobile phone repare Solder Paste 100g Solder Paste fo
New Equipment | Rework & Repair Equipment
The PDR E3G Evolution - Next Generation Rework System - is made of only the finest materials and components for optimum precision and rework excellence. Combining PDR's ThermoActive software technology with PDR's patented Focused - Visible IR Techno
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
100g Solder Paste for BGA refwork mobile phone repare 100g Solder Paste BGA refwork Solder Paste mobile phone repare Solder Paste 100g Solder Paste for BGA refwork Product description: 100g Solder Paste for BGA refwork mobile phone repare &
100g Solder Paste for BGA refwork mobile phone repare 100g Solder Paste BGA refwork Solder Paste mobile phone repare Solder Paste 100g Solder Paste for BGA refwork Product description: 100g Solder Paste for BGA refwork mobile phone repare &
FOR LARGE PCBS - The PDR IR-E6 Evolution rework system is specifically designed to be ultra-accurate and providing the ultimate performance when repairing today's PCB assemblies. The IR-E6 has a very large capacity, handling PCBs up to 26" (620mm) wi