New Equipment | Solder Materials
KappTecZ is a high temperature, high strength solder that may be used on most metals, but works extremely well on aluminum, copper and stainless steel. It has a high tolerance to vibration and stress, and good elongation for use on dissimilar metals.
New Equipment | Cleaning Agents
AIMTERGE 6035 cleaner is a saponifier formulated to readily remove resin, rosin, no clean and water soluble flux residues from printed circuit boards, while preventing the attack of components and aluminum hardware common with many saponifers. The re
ACP 120 series are an anti-oxidation solderable coatings, which have been designed for anti-corrosion and rusting for metal surfaces such as nickel, steel, aluminum and other metals; solderable surfaces on which solder paste, solder preform or solder
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2009-05-29 10:24:24.0
NASHVILLE � May 2009 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will highlight AQUANOX� A4241 and METALNOX� M6319US in booth 643 at the upcoming Medical Design & Manufacturing East, scheduled to take place June 9-11, 2009 at the Jacob K. Javits Convention Center in New York, NY.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2009-04-23 20:39:41.0
NASHVILLE � April 2009 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it has won a remarkable six awards on two continents during the last year.
Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
The BT-1 Plasma Etch System is fully automated and is capable of processing large quantities of parts up to 21"x21" for substrate cleaning and surface modification applications prior to bonding applications. VISIT THE PLASMA ETCH WEBSITE FOR MORE IN
Contact: Sandy Lin Add my wechat Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456
