Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
Electronics Forum | Sat Feb 14 19:35:51 EST 1998 | C. Lao
Mr Lao We have some specialist knowledge on this subject and offer both equipment and services for these tests. My first recommendation is that take coupons manufactured by your PC Fabricator and then samples at each manufacturing stage: Bare coupon
Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef
Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of
Electronics Forum | Tue Jun 26 15:05:02 EDT 2012 | upguy
Thanks for responding Fred and Peter. We have had the same damage to the tip occur even though our TP9-UFP sits in an air conditioned room (74 F / 23 C). I spoke with Matt at MyData (who was very helpful). He said that the X-axis bearings, the X-a
Electronics Forum | Fri May 03 18:55:41 EDT 2002 | davef
Interesting situation. Everything [ie, intermetallic compounds, solderability, etc] is speculative without knowing more about the materials of: * Leads. * Solderability protection. ... because suppliers use a fairly wide of materials. Your suppl
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
