Electronics Forum | Wed Aug 15 13:40:55 EDT 2001 | rkevin
Just as there are a number of causes of solder balling there are also several factors which can lead to or encourage the formation of solder beads. - During the placement of the component solder paste may be squeezed out from underneath the compone
Electronics Forum | Wed Sep 19 15:32:24 EDT 2001 | jschake
I�ll volunteer to answer this one for Jake. In order to prove the performance and capability of the stencil printing process, I think this level of inspection detail is required. However, in a production scenario where a known printing performance
Electronics Forum | Fri Nov 12 16:27:43 EST 1999 | Michael Allen
The papers I've read suggest that we need to be concerned if the weight percent of gold in the finished joint exceeds 3%. You might want to do the calculations to see where you stand, before you set up a process to "tin" the leads. If you find that
Electronics Forum | Fri Oct 24 13:21:12 EDT 2008 | evtimov
Hello Bong, I would make one test only. Make one batch using the problem part from a different vendor. That will answer your main question. For me the part is causing all your problems. If it is possible, change it. Last time having problem like you
Electronics Forum | Wed Jan 31 17:45:37 EST 2001 | dason_c
Hi! William, please check the new IPC-A-610 Rev C, para 12.4.10 for the soldeirng anomalies. Most of them may consider as process indicator and not the defect. The most common method to elimate the solder ball is to reduce the solder volume by red
Electronics Forum | Fri Mar 09 15:13:49 EST 2012 | davef
Care must be taken to not apply an excess of material, as the adhesive will flow under the device during placement and curing, and could cause a short. Printer setup: * Don't worry about stencil thickness. A wide range of stencil thicknesses (typic
Electronics Forum | Thu Mar 30 09:32:54 EST 2006 | russ
Not arguing dan, but are you positive that they are not copper? anyway, what is happening is as the parts sucks down onto the board from reflow the extra paste is notnecessarily sqeezed out but it has no place to go. So it will form this ball on th
Electronics Forum | Fri Jan 20 20:57:26 EST 2023 | hi_fonsi
We have a PARMI SigmaX SPI (Solder Paste Inspection) machine, right now I'm trying to understand about parameters of the machine. I know minimus, Maximus, and warning values need to be defined. Height value understands that can be defined by the thic
Electronics Forum | Thu Sep 01 14:30:06 EDT 2005 | lsmith
I have recently tried electroform (100% nickel) stencils. Expensive but awesome paste release. 5 mil foil 10 - 15% aperture reduction for gasketing
Electronics Forum | Sat Nov 11 07:54:53 EST 2006 | davef
Many use the following guideline when judging the proper paste for a stencil aperature: You want approximately 5 particles minimum across the smallest aperture.
