Electronics Forum | Thu Mar 22 16:35:06 EST 2001 | Steve
Deja vu! When I read your response I turned around to see if you standing behind me listening to our problem. We currently make about 50 different boards all using no-clean that have no problems, yet this newest boards has a couple of issues that eng
Electronics Forum | Sat Jun 09 14:28:58 EDT 2001 | Kelvin
No-clean solder paste is definately a trend for tomorrow. However, there are several points you need to consider before you shift from WS to no-clean: 1. Component quality - No-clean solder paste generally (not essentially) get a lower avtivity than
Electronics Forum | Sat Oct 09 03:26:58 EDT 1999 | Brian
| Always experiencing dross in pot with different characteristic such as color, shape, dry/wet etc. Any paper, wetsites provide the more comprehesive explanation on its characteristic | Dross is a mixture of various things. The obvious ones are met
Electronics Forum | Sat Jun 19 11:44:00 EDT 1999 | Vic Lau
Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,either at
Electronics Forum | Fri Jun 18 12:36:52 EDT 1999 | Brian
What is the future of HASL with lead-free solders? I have grave misgivings as, even if it works properly (which I'm not too sure about), the alloy will have to match that used in the soldering process, or nearly so. No use using a Bi-containing HASL
Electronics Forum | Wed Jun 16 08:56:34 EDT 1999 | Vic Lau
Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,either a
Electronics Forum | Wed Mar 17 19:58:00 EST 1999 | Marc Ruggiero
Hi folks, I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and sometimes f
Electronics Forum | Mon Sep 28 12:30:55 EDT 1998 | Bill Schreiber
Remember, even if you are successful in your justification of not cleaning your final product, there will always be a need for cleaning. Screens, stencils, misprinted PCBs, wave solder pallets, squeegees, tooling, etc. New cleaning applications can
Electronics Forum | Fri Mar 06 22:52:16 EST 1998 | Scott McKee
| I will be starting a conformal coating process soon, I am looking for any pointers on | 1) Best method for masking components, tape mask, liqued mask Masking tape or rubber caps will work, the ligued mask is too hard to remove. | 2) Which is best
Electronics Forum | Tue Aug 21 03:42:55 EDT 2001 | mugen
SMT community, My Fellows, 1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? 2) why is water-soluble (WS) not a hot choice? 3) All I know, *is in layman terms*, that BGA has tendency to trap water, should WS process be the c
