Electronics Forum: stencil apertures (Page 59 of 121)

Manual Stencil Cleaning Solvent

Electronics Forum | Fri Oct 07 15:49:58 EDT 2005 | Amol

Hi, Can anyone suggest what solvents are the best for manual stencil cleaning?? we are currently using alcohol wipes, but the fine pitch apertures still have solder paste stuck in between them. We should ideallyhave a stencil cleaner, but until that

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Wed Sep 22 22:23:55 EDT 1999 | SY

| | | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | | | thanks | | | | | | | | | We use 6

Using an air hose to clean stencils

Electronics Forum | Fri Nov 05 13:58:23 EDT 2010 | chartrain

I agree that the tines (webs between apertures) can become damaged on fine pitch stencils from a blast of air. If they get bent, the stencil won't seat and gasket properly allowing bleed out of paste. Of course we all know that the air being blasted

Re: 20 mil qfp bridging

Electronics Forum | Tue Aug 17 10:41:13 EDT 1999 | Steve A

Wayne, Sounds like a gasketing problem. When the horizontal apertures are bleeding but not the vertical apertures. Could be poor underside support, HASL miniscus issues, masking or plugging issues, but what many people do not account for is that t

Re: Tombstone

Electronics Forum | Tue Sep 14 10:54:37 EDT 1999 | Scott Davies

| Can anyone out there pls enlighten me on how to solve chip tombstone defects. | I am running a board with a lot of 0603 chip. i had fine the profile and the alignment, but it still happen randomly on the board itself. Is there any other way to sol

Glue Stencil Design Guidelines

Electronics Forum | Fri Aug 30 13:12:00 EDT 2002 | Mark Ross

Can anyone recommended any good books and/or articles relating SPECIFICALLY to stencil design for high speed production whereby adhesives will be stencil printed onto a PWB? The IPC document covering stencil design is not specifica at all. I know t

Screen Printing Adhesive

Electronics Forum | Thu Sep 30 17:39:54 EDT 2004 | dgjjr

We have been screen printing adhesive for about 4 years. Works well but it does require my opertators to pay more attention to what they are doing than they would prefer. Keep your stencils really clean. Once that epoxy dries in an aperture, it is

Calculating Solder Volume

Electronics Forum | Thu Nov 08 07:33:23 EST 2007 | hussman

Why? Just use IPC on finished solder joints as your guide. I've seen groups of people puts hundreds of hours into this task and then tell me a 3 mil stencil is all I need. After reflow, none of the solder joints meet IPC Class 1 and a lot of tombs

Stencil design (maybe old) question...

Electronics Forum | Wed Feb 04 10:01:55 EST 2009 | dcell_1t

Hi there, We're developing a DOE where stencil design (aperture design) is going to be evaluated, currently we have regular reduction on sides, home base (triangular and semi-circle), "C" or "U" shape, and an idea for oval shape for pasives also cam

Print Parameters

Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake

Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point


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