Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks
Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem
Electronics Forum | Thu Apr 24 23:04:45 EDT 2003 | yukim
I've been struggling with this problem for a while. We have two products: A, which is Ok and B, with tombstone defect (0603 & 0805 capacitor chips). A & B have the same design: pad sizes, separation between pads, components orientation. Both have s
Electronics Forum | Thu Aug 12 22:38:44 EDT 1999 | Dave F
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
Electronics Forum | Thu Nov 16 22:01:16 EST 2000 | Early Moon
I promised never to do this - BUT only for you needy folks when I have nothing else to do. And Dave's basically a good person though not as needy as most really needing this stuff. 1) Ensure internal Gerber data really matches board and stencil (Ger
Electronics Forum | Wed Jan 30 12:53:58 EST 2008 | tonyamenson
In approximately one month I am installing 2D at our DEK print station. We are going with the basic (cheap) software options and 2D camera. After it is up and running we will determine if it is indeed useful. At that point we will decide on the adva
Electronics Forum | Thu May 18 10:20:55 EDT 2006 | slthomas
Russ asks good questions and I think Chunks pretty much nailed it. Aspect ratio (aperture width/stencil thickness) s/b 1.2 minimum (I like 1.5 if I can get it). If your aperture width = lead width (.008"), yours is 1. Tough to get consistent paste r
Electronics Forum | Wed Aug 09 05:15:36 EDT 2023 | serge_pirog
You can use a stepper stencil but you can also try print outside of contact pads. Design an aperture that extends beyond pads and paste will be on the soldermask. In the oven it will return to leads. If you need help with development, please contact
Electronics Forum | Tue Oct 03 20:35:23 EDT 2000 | Dave F
1. Throughput * Dispenser: Slower, may loose 70% of tact on fast chip shooters * Printer: Can be put in front of and use fast chip shooters effectively 2. Rework Rate ???? Deposition control???? * Dispenser - High control over amount paste - Coplan
Electronics Forum | Fri Nov 09 11:55:49 EST 2001 | mparker
If you are getting solder shorts under a device, how would "hiding" the extra long pad with solder mask help? If the pad can't be seen once the device is in place, it is already "hidden". Getting your customer to redesign the pads may take some time
Electronics Forum | Thu Jun 21 22:04:18 EDT 2001 | davef
This is my attempt at beating the "Fuzzburg 7" translator used on the SMTnet Forum that mashes everything it sees. Below the next paragraph are three paragraphs,each with a common numering sequence, where each paragraph represents the columns of a t
