Electronics Forum | Fri Apr 06 12:31:07 EDT 2018 | deanm
Your fluxes are required to be compatible per J-STD-001. I wouldn't even attempt mixing no-clean (rosin) and clean (assuming water soluble) fluxes on the same assembly, especially if the fluxes are from two different vendors. If your paste and liquid
Electronics Forum | Mon Nov 04 12:50:23 EST 2002 | babe
Sorry for being late on the reply. Whatever you do, flux from the container or the manufacturers flux pens. Stick witht the same chemistry. Mixing chemistries, IE: different fluxes will create more problems in rework than you will see if you use the
Electronics Forum | Mon May 19 19:32:50 EDT 2003 | Dave
Hello. We have a low profile LCC on a board. The clearance is ~ 2mils after reflow. Cleaning away residual flux with an ultrasonic 50C water cleaner caused some LCC and 0201 components to loosen. Should we stay away from the ultrasonic cleaner?
Electronics Forum | Mon Nov 10 22:29:31 EST 2008 | fctassembly
Hello Hoss Voidin/blow holes can also be exacerbated by residual flux. Have you experimented with dwell times and separation speed parameters with your selective ? What related parameters are you currently running processing under ? regards Jim
Electronics Forum | Mon Apr 29 10:42:47 EDT 2002 | Jim M.
I had problems with white residues on both WS609 and WS 3060.The WS 3060 turned out to be a carbonized material.The composition after analysis (Energy Dispersive X-ray spectrum) turned out to be tin,tin,phosphore and cloline and tin. Alpha also have
Electronics Forum | Sun Sep 09 08:38:14 EDT 2018 | devinpcb
I have found the paste flux is the worst. It leaves a black residue that can corrode.
Electronics Forum | Wed Oct 06 23:36:28 EDT 1999 | karlin
| | | Hi, | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | Question: | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z
Electronics Forum | Thu May 31 11:26:33 EDT 2007 | gsala
Tnks Patrick, additional infos..... we are just playng with different NC solder wires L-F, the best results in terms of solderability (faster solder flowing, holes filling up) it seams are coming from an ROM1, as we know, according to J-STD-004, or
Electronics Forum | Thu Aug 12 09:02:08 EDT 1999 | Gian.D
| Hello, | | Could be that touchup operators are using too much flux. What are you dispensing flux with. Disposable or refillable flux pens are good to have around. | |Good! could you suggest some suppliers name or address or web site or e.mail...
Electronics Forum | Tue Nov 30 16:50:20 EST 1999 | Dave F
Greg: It depends on the specifics of the flux you are using. You didn�t say. Generally, using a: � "No-clean flux" should create no flux entrapment problems for most applications. � RMA with 25% or more solids as a "no-clean" should create no flu
