Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood
We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Fri Mar 05 04:39:38 EST 1999 | Pan Tian Shun
I need advise on how can bonding of ICs to flex foil be done. The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), and curre
Electronics Forum | Sat Mar 06 08:45:16 EST 1999 | Dave F
| I need advise on how can bonding of ICs to flex foil be done. | The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. | | Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), a
Electronics Forum | Thu Nov 03 21:40:40 EST 2005 | davef
There maybe multiple drivers to your problems. * First, decreasing bond quality with time indicates a plating issue. What's the actual thickness of your gold and nickel on the pads? * Second, the no-sticks indicate contamination. If it's organic, p
Electronics Forum | Thu Jan 02 21:54:18 EST 2003 | jonfox
This should be a fun one! I was asked the question from our Engineering, should we use die attach with wire bond or go ahead into the new world of flip chips? Right now, I am faced with information overload about the two processes but I am really l
Electronics Forum | Mon May 10 23:10:40 EDT 2004 | yvonne heng
Hi Jon, well,i think that wirebond is still the best option at the moment since it is more flexible unless size is one of the important factor.
Electronics Forum | Tue Nov 15 11:21:32 EST 2005 | davef
Which is it: * Wire bonds don't stick when bonded * Wire bonds fall off, or break during service
Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia
Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But
Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
