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Used SMT Equipment | X-Ray Inspection
Nice used Nicolet/Focal Spot X-Ray inspection machine. Factory refurbished by Focal Spot w/new tube at time of refurbishment. Believed to have been refurbished in 2012-2013 based on paperwork. 90KV Windows 7 PC with BGA void analisys software
New Equipment | Solder Materials
NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC
40mm Applications Solder Joint Quality (BGA, Leaded) Bridging Voiding Opens Bare boards (Inner layers, traces, vias) Component Package Inspection (wire bonds) Subtle Defect Inspection
New Equipment | Solder Materials
AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305, REL22, REL61, and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly success
Application Field BGA/IC LED Aluminum Die casting Battery Connector Main Features of X-6600 X-Ray inspection machine * Closed Tube From HAMAMATSU Japan * Imported Detector from Korea Rayence * Micro-focus,focal spot size down to 5µm
Used SMT Equipment | X-Ray Inspection
This Phoenix X-Ray system will be available in the M-Flex Online Auction being held on Dec. 14-15. These assets are located in Anaheim, California and will be sold to the highest bidder. Phoenix Nanome/x 180 X-Ray System; Model: Nanome/x 180; SN: A
Used SMT Equipment | X-Ray Inspection
GlenBrooks RTX-113, real time X-ray system X-Ray tube was replaced (apx $7.5k value) 12" Monitor, X-Ray Tube, Power Supply and Controls. Glenbrooks patented XRTV High Sensitivity X-Ray Camera, enhanced with eight frame recrusive averaging. Image
Technical Library | 2015-01-05 17:38:26.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
New Equipment | Test Equipment
• 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function workstation with±70° tilt and X-Y-Z-Q-M multi-axis movement and CNC auto-detect &bu
