New Equipment | Cleaning Agents
CYBERSOLV C8622 is a full-strength solvent blend specifically designed as an IPA alternative for under stencil wiping and manual bench top cleaning applications. C8622 is ideally suited for dissolving un-reflowed solder paste during the stencil print
Industry News | 2018-05-09 20:32:24.0
KYZEN announced that it will reveal the latest research findings from controlled laboratory tests conducted in the interest of improving stencil printing reliability at SMT Hybrid Packaging 2018. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared in Hall 4A, Stand 536, June 5-7, 2018 at the Messe in Nuremberg, Germany. The introduction video can be viewed here: www.KYZEN-SneakPeek.com
Industry News | 2016-02-16 11:39:48.0
KYZEN announced that it will reveal the latest research findings from controlled laboratory tests conducted in the interest of improving stencil printing reliability at the 2016 IPC APEX EXPO. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared in Booth #1869, March 15-17, 2016 at the Las Vegas Convention Center.
Industry News | 2009-07-02 17:51:04.0
Recognising that too many print processes are compromised by poor quality Consumables, DEK’s Process Improvement Products are designed to boost productivity and yield, reduce the risk of defects and minimise rework.
Industry News | 2009-07-07 13:32:54.0
Recognising that too many print processes are compromised by poor quality Consumables, DEK’s Process Improvement Products are designed to boost productivity and yield, reduce the risk of defects and minimise rework.
Industry News | 2010-06-11 13:38:26.0
TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that, according to various studies, the implementation of its Sawa Eco-Roll SC-ER360 wiper roll cleaner provides a 50 percent reduction in costs.
Industry News | 2011-09-21 14:09:34.0
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight its new advanced machinery in Booth #136 at the upcoming SMTA International Conference & Exhibition
Industry News | 2018-08-09 13:06:22.0
Speedprint Technology has added a new printer platform to its product range. The SP1220 is expressly designed to accommodate mid-sized long boards up to 48 inches (1220mm) in length. The robust new SP1220 platform delivers print accuracy to 12.5µm at 6-sigma and repeatability performance that parallels Speedprint's famed SP710.
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
