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. Enclosed voids can cause a displacement of electrical and thermal paths as well as a local concentration of power and heat. Additionally, gas voids are quick to form spheres in the solder gap, which could cause the tilting of chip components and a wedge-shaped solder gap
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. I would suggest two items to consider. One is to review the artwork to determine the metal load on each pad. Secondly, review the thermal profile for the particular product being processed to verify the proper temperatures were met during the reflow cycle
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