Electronics Forum | Mon Dec 27 22:45:58 EST 1999 | Jim
Is there a way to avoid the reliability problems arising from the tce mismatch between ceramic chip smc's and FR4 laminates, without spending an arm and a leg on expensive substrate materials? Are there inexpensive substrates with reasonably compata
Electronics Forum | Thu Aug 12 00:17:15 EDT 1999 | DLKearns
Wanted to know if there was a good "to go by" tip other than the customers(if it helps current req.,10% of 30% of trace) requirements, about pits in the traces on copper plated ceramic substrates? More to the point how many is too many regardless of
Electronics Forum | Tue May 04 10:38:24 EDT 1999 | Dave F
| Does someone has experience with solder stop on components to avoid an Viking effect (no solder on the pad, all solder on the lead)? What kind of solder stop does work well? What is dangerous? What has to be kept in mind when using such components?
Electronics Forum | Thu Feb 25 18:29:48 EST 1999 | Karl
| Fab Gurus, (Earl) | What are the disadvantages of using paper phrenwhatsit as a substrate. I want to justify changing a substrate from paper to chem3 or FR4 and I need some info regarding long term failure issues, etc. | | Thanks, | Justin | Ther
Electronics Forum | Mon Jan 11 20:26:54 EST 1999 | Chris G.
I have used conductive adhesives for some time now on thickfilm. Does anyone know of a really good conductive adhesive to attach flip chips to flex circuits? I would like to stencil print the adhesive to the substrate and then place the flips chips
Electronics Forum | Thu Aug 13 03:10:22 EDT 1998 | Terry Keen
| Couple of questions. | 1) Are we talking alumina substrates as the ceramic material? | 2) Are we co-firing gold as the conductors on the substrate surface? | 3) In other words, is this a hybrid thick film circuit? | 4) If so, how large or small? S
Electronics Forum | Wed Mar 25 13:29:08 EST 1998 | Gary Simbulan
We currently use an abrasive fiberglass brush to clean the silver oxide off of our substrates proir to asembly. It's messy and tiring. Is there an alternative method, either chemical or mechanical that is cost effective for small (30 to 50ea 6in sq
Electronics Forum | Mon Aug 27 10:09:50 EDT 2001 | gresko
Steve, Depending on the type of equipment you are using for P&P you may want to consider placing and processing the substrates in Auer boats. I have provided many applications for ceramic substarate users using purchased Auer boats or machined palle
Electronics Forum | Wed Sep 19 13:43:49 EDT 2001 | jschake
I cannot report having experience with 0201 printing applications on flex circuits. Generally, I would be concerned with handling of the flex substrate. A carefully designed vacuum capable custom tooling fixture would likely be required to ensure p
Electronics Forum | Mon May 06 11:37:00 EDT 2002 | dwboost
Our company specializes in quick turn Printed Circuit Boards; prototype and short run quantities. A customer has inquired about using Kevlar as the substrate. Can anyone give us the name of a supplier of Kevlar? Is the production process compatible w
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