Industry News | 2011-04-29 17:28:45.0
Celebrating the best of electronic interconnection research being conducted by both industry leaders and academia, IPC announced the 2011 Best Industry Posters and the winners of the IPC Academic Poster Competition at IPC APEX EXPO, held April 12–14, 2011 in Las Vegas.
Effective and efficient solution for the most challenging printing applications. The MPM Momentum II stencil printer is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)
Events Calendar | Wed Jun 07 00:00:00 EDT 2023 - Wed Jun 07 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 2 of 3)
Used SMT Equipment | Screen Printers
Momentum is designed to provide efficiency and speed. With its triple track conveyor rails and servo drive motors, for example, the Momentum Elite model orders the highest performance capacity in the series, making it the ideal printer for high volum
Industry News | 2011-05-17 11:04:30.0
High Yield BGA Reballing Simplified
Product technical points ● Humanized design ● Wide application range and strong versatility ● Unique spray automatic cleaning system ● High-efficiency and energy-saving wiping and paper-saving structure ● Unique image processing system ● Intelligent
Product technical points ● Humanized design ● Wide application range and strong versatility ● Unique spray automatic cleaning system ● High-efficiency and energy-saving wiping and paper-saving structure ● Unique image processing system ● Intelligent
Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Industry News | 2015-06-18 17:23:06.0
IPC Association Connecting Electronics Industries® has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. This ever evolving standard provides common language of terms and definitions for the electronics industry.
