Electronics Forum | Tue Jul 31 07:56:43 EDT 2018 | markme
A question for those that carry out SPI. How do you program? Do you take CAD data for the card which will provide a 1-1 pad outline or do you use the stencil data for the program is the actual tool used to determine the paste volume (Aperture reduct
Electronics Forum | Fri Mar 09 05:06:09 EST 2012 | grahamcooper22
Is your solder paste deposit drying out? Or if the paste deposit is small or there is insufficient paste then the tack between the device and paste will be poor so it can easily come out of the paste during its placement or placement of other parts.
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Tue Aug 17 10:21:32 EDT 1999 | Steve A
It may be worth mentioning to those that do not have the ability to rotate the PCB, that some folks adjust their aperture design on fine pitch leads by increasing the aperture size for those leads parallel to the X axis, thus allowing consistent volu
Electronics Forum | Fri Jun 04 09:20:55 EDT 1999 | HST-SE
Al, We make stencils, and I was personally involved at AMTX when the electroformed process was developed. Some of this will sound like an ad, but everyone has been volunteering vendors and so look at this as a suggestion. Electroforming is an addit
Electronics Forum | Wed Jan 16 20:08:48 EST 2002 | davef
Comments are: * Some people use calibrated boards and components to remove sources of variation when using their CMM to measure placement accuracy. Sources of supply are listed in the fine SMTnet Archives. * It�s unclear that a single board will mee
Electronics Forum | Wed Aug 18 15:20:25 EDT 1999 | John Thorup
| Hi, | I'd like to ask some tips about the merits and shortcomings o | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | application? | The boards contain no BGA and
Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno
Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o
Electronics Forum | Sat May 30 01:31:49 EDT 2009 | mika
make 4 square rounded corner apertures on the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. Don't worry to much of the void's. Just following my tips and you will be fine. The
Electronics Forum | Mon Dec 06 14:44:41 EST 2021 | dwl
1 to 1 stencil aperture to pad should be fine on the gull leads, and yield 100% coverage with leaded solder. The thermal pad is going to be a challenge though, if you truly need 100% coverage. There will be out gassing from the flux and this will nee
