Full Site - : poor solderability (Page 6 of 137)

Nihon Superior’s New General Purpose Solder Wire Wins a 2014 NPI Award

Industry News | 2014-03-26 10:21:33.0

Nihon Superior Co. Ltd. announces that it has been awarded a 2014 NPI Award in the category of Cored Wire for its SN100C (031) Lead-free Flux-Cored Solder Wire.

Nihon Superior Co., Ltd.

3D SPI  Online Machine S8080

3D SPI Online Machine S8080

New Equipment | Inspection

Features: 1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. 2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating m

ShenZhen Sinic-Tek Vision Technology Limited

Sinic-Tek  3D SPI Online Machine  L1200

Sinic-Tek 3D SPI Online Machine  L1200

New Equipment | Inspection

Features: 1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. 2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating m

ShenZhen Sinic-Tek Vision Technology Limited

Analysis of the Mechanical Behavior, Microstructure, and Reliability of Mixed Formulation Solder Joints

Technical Library | 2023-09-26 19:14:44.0

The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC) solder balls. Such parts are often assembled to printed circuit boards using traditional 63Sn-37Pb solder paste. The resulting solder joints contain unusual quaternary alloys of Sn, Ag, Cu, and Pb. In addition, the alloy composition can vary across the solder joint based on the paste to ball solder volumes and the reflow profile utilized. The mechanical and physical properties of such Sn-Ag-Cu-Pb alloys have not been explored extensively in the literature. In addition, the reliability of mixed formulation solder joints is poorly understood.

Auburn University

JUKI RP-2 Full Automatic screen printer SMT solder paste printer PCB stencil printer with high precision

New Equipment | Printing

JUKI High Precision Solder Paste Printer RP-2 with high precision Details Images Features Auto solder paste replenishment system The solder paste is automatically dispensed across the entire squeegee length, maintaining at 15 mm rolling diame

Chengyuan Industry Automatic Equipment Co. Ltd

Flex Interconnect Technologies’ CEO Discusses Routing in the 3D World during IPC Design Council Meeting

Industry News | 2013-07-09 16:18:50.0

Flex Interconnect Technologies (FIT) announces that its CEO Chetan Shah recently held a successful presentation for the Silicon Valley Chapter of the IPC Designer Council.

Flex Interconnect Technologies

High quality stainless steel solder paste stencils

High quality stainless steel solder paste stencils

New Equipment |  

Do you have to wipe your stencils after only a few circuit boards? Do you have to spend time at the rework station fixing shorts? Do you pay extra premiums for quick turn stencils? Do you sometimes receive poor quality stencils? ASI has taken the el

ALTERNATIVE SOLUTIONS INC

SEHO Systems and Balver Zinn Announce Selective Soldering Seminar

Industry News | 2012-06-25 13:08:17.0

SEHO North America, Inc. and Balver Zinn announce a Selective Soldering Seminar from the SEHO Academy, scheduled to take place Tuesday, September 25, 2012.

SEHO Systems GmbH

SEHO Systems and Balver Zinn Announce Selective Soldering Seminar

Industry News | 2012-06-25 13:08:52.0

SEHO North America, Inc. and Balver Zinn announce a Selective Soldering Seminar from the SEHO Academy, scheduled to take place Tuesday, September 25, 2012.

SEHO Systems GmbH

SEHO Academy to Host a Selective Soldering Seminar

Industry News | 2011-04-27 18:38:35.0

SEHO North America, Inc. announces a one-day Selective Soldering Seminar from the SEHO Academy presented by Dr. Ronny Horn, and scheduled to take place Wednesday, June 29 or Friday, July 1, 2011 at its facility near Cincinnati.

SEHO Systems GmbH


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