Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2011-09-23 22:09:26.0
Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.
Industry News | 2023-12-18 13:13:45.0
SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components.
Industry News | 2022-01-10 16:49:36.0
SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.
New Equipment | Industrial Automation
SMT PCB Vacuum Loader Suction loader Power Source: 220-230VAC Maximum PCBs Capacity 300 pcs Cycle Time Approx. 6 seconds Power Consumption 180VA max Product description: SMT PCB Vacuum Loader Suction loader Bare Board Loader, Power Source: 220
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Industry News | 2017-10-17 20:12:01.0
PDR today announced plans to exhibit with its Italian distributor Tecnolab in Hall A2, Booth 459 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Technolab will display PDR’s IR-E3G Gold SMD/BGA Rework Station and IR-TS One Benchtop Thermal Testing System. PDR’s advanced focused IR rework technology is ideal when reworking multiple components on the same PCB. The company’s nozzle-free design offers the immediate configuration of your system for same size and varying size components without having to stop and change air nozzles.
Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
New Equipment | Cleaning Equipment
SMT Fixture Cleaning Machine SME-5200 Cleaning basket size φ1000mm x H 200mm Clean tank capacity 80L Dry time 10~20Min Machine weight 500KG Product description: SMT Fixture Cleaning Machine SME-5200, Cleaning basket size φ1000mm x H 200mm, Cle
Industry News | 2022-09-15 06:27:38.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.
