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3D XPI 5000L - In-Line SPI System

3D XPI 5000L - In-Line SPI System

New Equipment | Inspection

Technical Innovation The first 10 bit image processing in its industry by on-the-fly vibrationless scan (High speed & high precision image acquisition) 4 times higher height measurement resolution than the existing Moire technology (The best

Synapse Imaging Co., Ltd.

S-460i/600i Inline SPI Machine

S-460i/600i Inline SPI Machine

New Equipment | Test Equipment

The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required me

1 CLICK SMT TECHNOLOGY CO., Limited

Marantz ISO-Spector M1 510L

Marantz ISO-Spector M1 510L

Used SMT Equipment | AOI / Automated Optical Inspection

INSTALLED November 2018! Looks and smells like new.   ISO-Spector M1 510L | Art Code: G300_510L AOI Machine Inline M1 AI TopographicIn-line Full 3D Artificial Intelligent AOI for up to 510x680mm (20x26") PCBs | Automatic solder joints inspection thro

KVMS SMT Equipment Services Supplies

Koh Young America, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer / Other / Training Provider

Koh Young is the leading True3D™ measurement-based inspection solutions provider supported by its global offices to ensure close communication with a growing customer base to provide access to AI-powered process optimization tools

3D SPI Offline Machine T-3010a

3D SPI Offline Machine T-3010a

New Equipment | Inspection

Features: 1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. 2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating m

ShenZhen Sinic-Tek Vision Technology Limited

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

New Equipment | Test Equipment

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us

Akrometrix

Akrometrix LLC to Demonstrate Real-Time Analysis, Array Generation (wafer partitioning), and 2D/3D Interface Analysis Software at productronica, U.S. Pavilion Hall A3, Booth 112/1

Industry News | 2015-10-22 16:56:59.0

Akrometrix LLC will exhibit in Hall A3, Booth 112/1 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Company representatives will exhibit Akrometric’s TherMoire’ AXP modular metrology platform which provides shadow moire’, digital fringe projection, and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

Akrometrix LLC Will Discuss Thermal Warpage and Strain Metrology at APEX

Industry News | 2016-02-17 16:31:00.0

Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos

Industry News | 2016-02-18 19:59:51.0

Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

3D SPI  Online Machine S8080

3D SPI Online Machine S8080

New Equipment | Inspection

Features: 1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. 2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating m

ShenZhen Sinic-Tek Vision Technology Limited


moire searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling Machine with CE

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Solder Paste Dispensing

World's Best Reflow Oven Customizable for Unique Applications
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Component Placement 101 Training Course