Electronics Forum | Mon Jun 21 15:46:00 EDT 1999 | Chrys Shea
I swear I posted it! I smoked an entire cigarette waiting for the damn thing to upload! I'll try it again when I get home tonight. Sorry for the inconvenience.
Electronics Forum | Mon Jun 21 21:14:16 EDT 1999 | Dave F
| I swear I posted it! I smoked an entire cigarette waiting for the damn thing to upload! I'll try it again when I get home tonight. | | Sorry for the inconvenience. | | | regular or filter?
Electronics Forum | Thu Mar 28 11:37:08 EST 2002 | Bob
I have been looking at cross sectioned joints. In some instances there are areas where there are large concentrations of silver. Could anyone quantify what is too much and also explain how the intermetallics are formed. Thanks.
Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef
They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm
Electronics Forum | Fri Oct 10 13:35:56 EDT 2003 | swagner
Does anyone have any data about the dangers of reflowing BGA's twice? I have a customer that is concearned about cracking in the intermetallic layer after the second pass. Thanks in advance.
Electronics Forum | Fri Dec 26 00:30:36 EST 2003 | Indy
hi, I wondering if anyone have any information on intermetallic growth in 80Au20Sn solder alloy. I have read that it has high reliability. Which bring an important question to my mind. What about Gold embrittlement ? Bye Indy
Electronics Forum | Thu Jan 15 09:04:36 EST 2004 | rkevin
Does anyone have any information about eliminating voids on BGA using SN62 as opposed to the normal Sn63, something which explains the inter-metallic layers which form during the soldering process and the leaching out of silver ?
Electronics Forum | Tue Mar 09 21:17:10 EST 2004 | gm05688
When soldering a metalized germanimum window to a nickle plated kovar part, I would like to understand the intermetalic. Does the nickle plate actually melt or will the solder(SN63)simple stick to the nickle and not cause nickle to reflow? Any one ou
Electronics Forum | Thu Sep 02 21:51:54 EDT 2004 | davef
Curious, but thoughts are: * Your pretinning pot is loaded with gold that has been removed from lead over a period of time * Your failed solder connections are caused by something else other that gold intermetallics * Your tinning process is undiscip
Electronics Forum | Mon Apr 25 21:52:58 EDT 2005 | KEN
I wonder if yor customer means wrong "flux"? Your not solderng to gold. Your soldering to Nickle. The gold is disolved and dispersed. Your joint strength comes from the SnNi intermetalic.
