Full Site - : high reflow temperature (Page 6 of 1856)

MIRTEC to Offer Live Remote Demo of the GENESYS-PIN 3D Pin Inspection System at SMTconnect

Industry News | 2022-04-13 10:22:58.0

MIRTEC will premier its line of 3D AOI and SPI Inspection Systems Hall 4A, Stand 128 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg.

MIRTEC Corp

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at the SMTA Guadalajara Expo 2023

Industry News | 2023-09-25 14:05:43.0

MIRTEC is pleased to announce its participation in the upcoming SMTA Guadalajara Expo on Wednesday, Oct. 25, 2023. The event is scheduled to take place at Expo Guadalajara in Jalisco, Mexico. In Booth 319, MIRTEC will feature a total of four (4) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry:

MIRTEC Corp

More Capacity for Compact Electrolytics

Industry News | 2003-03-20 08:12:57.0

Nichicon has increased the top capacitance value of its WG series of surface mount electrolytic capacitors from 1000 to 1500uF.

SMTnet

Flatpack Relay Handles Heavy Currents Onboard

Industry News | 2003-06-20 08:18:46.0

Providing the ideal solution to high-current PCB applications where height restrictions are a major consideration is Finder's 40.11 series flatpack PCB relay.

SMTnet

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

MIRTEC Receives GLOBAL Technology Award for MV-9 SiP HYBRID 3D AOI

Industry News | 2021-11-22 07:27:39.0

MIRTEC is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Inspection – AOI systems for its MV-9 SiP HYBRID 3D AOI system. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany.

MIRTEC Corp

Evaluation Kit for Novel Board-to-board Jumpers

Industry News | 2003-03-04 08:08:23.0

In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.

SMTnet

No Solder Required for Press-fit D-subs

Industry News | 2003-04-08 10:28:06.0

A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.

SMTnet

SMT Hautes Technologies Selects MIRTEC for Leading-Edge 3D AOI Technology

Industry News | 2016-11-14 20:04:34.0

MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that SMT Hautes Technologies, has selected MIRTEC’s award winning MV-7 OMNI as their future 3D AOI platform of choice.

MIRTEC Corp

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet


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