Electronics Forum | Wed Sep 22 21:15:44 EDT 2021 | djenkins62
Hello Everyone: Heat Can Be Very Damaging to Boards and well as extended oven time can cut into valuable production time. Steel Camel is testing ambient temperature drying to remove diffused and embedded moisture in PCBs. We are seeking scrap pie
Electronics Forum | Wed Apr 07 22:15:31 EDT 2004 | davef
We're not familiar with the AUG5 from Taiyo. [It doesn't show on their US site.] Is it liquid photoimageable? Printed solder masks are more likely to bleed. But you wouldn't have any solderability with bleed. Your plating seems acceptable [if th
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Wed Jan 03 10:56:46 EST 2001 | Mike Konrad
Hi Dave, Water soluble flux has two opposite attributes. #1: It is the easiest flux to remove. #2: It is the worst flux to leave behind on a board. As for # 1, there are many de-fluxing systems out there that are very capable of removing water
Electronics Forum | Wed Nov 03 22:25:09 EST 1999 | Steve Evers
...Just not sure you'd want to pay for it just yet. NdYAG wavelength, slightly diffused beam, tightly moderated power and amplitude control. Add to that a laser safe enclosure that insists on watching your work through a dark green filtered window
Electronics Forum | Tue Dec 15 15:21:24 EST 1998 | Chrys
| SMTneters, | I'm famialiar with lambda, omega, and gemini waves but not with "A" wave. Can somebody give me an explanation? | | thanks | | Tom B. | Tom, The term "A" wave refers to an asymetrical wave. It's an Electrovert term that describes
Electronics Forum | Thu Sep 17 07:06:15 EDT 1998 | joakim fagerlund
We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material is Au/S
Electronics Forum | Tue Jan 29 20:13:30 EST 2002 | davef
Over-time lead separates from the tin in solder by force of nature [diffusion], but I assume that is not what you are talking about. Please help us understand your question better. Are you saying that the solder does not attach properly to the comp
Electronics Forum | Wed May 15 12:55:11 EDT 2002 | fmonette
Hi Dave, The short answer is "not any significant amount" of moisture is removed during reflow. The temperature excursion is much too short. If you look at the physics of moisture diffusion inside a package you will see that only the surface moist
Electronics Forum | Tue May 14 14:48:33 EDT 2002 | fmonette
Hi Dason, Here is some relevant information that you might find useful : J-STD-033, section 7.1.2.2 Dry Box : "Components may be placed in a dry box, capable of maintaining 25+/-5C and less than 10%RH. Nitrogen or dry air may be used." In other w
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