IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
New Equipment | Cleaning Equipment
QYSMT / MOREL Fully Automatic Stencil Cleaning System BMP-750 Features ▶All stainless steel body, beautiful, wear resistance, corrosion resistance, in line with environmental protection requirements and standards. ▶The fully pneumatic operation, n
Industry News | 2022-10-14 02:39:56.0
I.C.T M series pick and place machine is mainly used for the production of LED lamps. Its positioning is aimed at small and medium-sized LED manufacturers or LED companies that have just started a business. Due to its low initial investment, the cost performance is very high.
Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Industry News | 2020-03-08 16:49:19.0
IPC announces the release of five newly revised standards covering several areas of the supply chain, IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements; and IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2011-08-24 22:37:23.0
The SMTA announced that it will hold sessions and a tutorial on Package-on-Package (PoP) surface mount stacking at their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2003-05-21 08:13:48.0
Two half-day workshops on Thursday during SMTA
Industry News | 2015-09-03 16:43:41.0
ISVI Corp. has announced the signing of a distribution agreement with ATEsystem s.r.o. to address the Czech Republic and Slovakian Automated Imaging markets with sales and support of its cameras.
Industry News | 2016-01-11 11:16:03.0
ISVI Corp. announces the signing of a distribution agreement with Advanced Imaging Components (AIC), Inc. to address the Japanese Automated Imaging market with sales and support of its cameras.
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