Industry News | 2015-09-30 10:08:42.0
IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.
Industry News | 2017-04-11 21:32:40.0
SMTA and SMART Group announce experts from IBM Corporation and Siemens AG will keynote the Contamination, Cleaning and Coating Conference. The conference is scheduled May 22-24, 2017 at the Radisson Blu Airport Hotel in Amsterdam.
Industry News | 2017-05-15 16:35:00.0
SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2018-01-15 13:37:11.0
The SMTA is pleased to announce the Best Papers from SMTA International 2017. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Industry News | 2019-01-30 08:13:02.0
The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Industry News | 2020-01-08 16:51:58.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on February 20th from 5:00 PM to 7:30 PM at PACE Worldwide in Elkridge, MD. Jason Fullerton, MacDermid Alpha Electronic Solutions, will be presenting “Advances in Lead-Free Solder Technologies for High Reliability Applications.”
Industry News | 2020-03-08 16:49:19.0
IPC announces the release of five newly revised standards covering several areas of the supply chain, IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements; and IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2020-04-14 18:49:39.0
EAE, the Electronic Assembly Equipment division of ITW is the proud recipient of an IPC APEX 2020 New Product Innovation (NPI) Award. The award recognizes the Electrovert DwellFlex 4.0 wave solder nozzle.
Industry News | 2020-06-24 15:45:07.0
IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
