Industry News | 2003-07-08 09:48:46.0
taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Industry News | 2016-04-13 16:56:22.0
The SMTA Capital Chapter is pleased to announce it will welcome Martin K. Anselm, Ph.D., Rochester Institute of Technology, on June 2nd to instruct a tutorial on SMT Principles at Zentech Manufacturing an ITAR facility located at 6980 Tudsbury Road, Baltimore, MD, 21244. The tutorial is scheduled from 8:30 am to 4:00 pm and includes lunch and a tour. As Zentech is an ITAR facility only US Citizens can participate in the tour. This tutorial is designed for those involved in printed board design, bare board fabrication, SMT assembly, quality control, materials purchasing, and reliability testing. New this year! Get a $20 EARLY BIRD discount on regular member and non-member registrations if registration is completed by midnight on April 30, 2016. Registration is required for this learning event.
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
Customizable 0.3-5.0mm diameter sn42bi58 lead free solder wire lead free solder wire sn42bi58 0.3-5.0mm diameter Customizable Product description: Customizable 0.3-5.0mm diameter sn42bi58 lead free solder wire INQUIRY Customizable
Customizable 0.3-5.0mm diameter sn42bi58 lead free solder wire lead free solder wire sn42bi58 0.3-5.0mm diameter Customizable Product description: Customizable 0.3-5.0mm diameter sn42bi58 lead free solder wire INQUIRY Customizable 0.3-
Customizable 0.3-5.0mm diameter sn42bi58 lead free solder wire lead free solder wire sn42bi58 0.3-5.0mm diameter Customizable Product description: Customizable 0.3-5.0mm diameter sn42bi58 lead free solder wire INQUIRY Customizable
New Equipment | Soldering - Other
http://www.flason-smt.com/product/Customizable-0-3-5-0mm-diameter-sn42bi58-lead-free-solder-wire.html Flason SMT Customizable 0.3-5.0mm diameter sn42bi58 lead free solder wire lead free solder wire sn42bi58 0.3-5.0mm diameter Customizable Prod
