Electronics Forum | Fri Jun 25 13:52:51 EDT 2010 | tate350
Are there any tantalum caps near the BGA? I have seen "wet" tant caps releasing moisture during reflow and disrupting the BGA balls. It may result in missing balls or bridging.
Electronics Forum | Fri Jun 25 14:49:43 EDT 2010 | patrickbruneel
Just skip the squirt bottle and your problem is solved. Cored solder has enough activity for proper wetting. When occasionally extra activity is needed use a fluxpen.
Electronics Forum | Wed Jul 28 08:41:47 EDT 2010 | vetteboy86
I believe we are seeing some wetting issues as we have tried to bake these assemblies ourselves. Our PCB supplier is coming in next week to address the issue. Is there a rule of thumb or formula for determining correct parameters. Thanks
Electronics Forum | Wed Jul 28 09:15:46 EDT 2010 | vetteboy86
I took a pad that did not have any solder flow (wetting issue with pad) and not reworkable with soldering iron, and scraped with an exacto knife. After scraping the pad soldered fine. Any suggestions?
Electronics Forum | Thu Aug 05 14:58:18 EDT 2010 | mikesewell
Smaller and multi-row QFNs will probably require an oblique view/5-axis xray with resolution of at least 1 micrometer and preferably a nanofocus machine. Given the low standoff and small pad size, verifying wetting can be challenging on interior pad
Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Fri Oct 01 10:00:10 EDT 2010 | 18424
We currently use and have used Aim W/S 483 for the past ten years. We have had great support from AIM. Paste Characteristics, wetting, slump, washing is all outstanding. Great activity, works well with NiPd and other lead frames.
Electronics Forum | Thu Feb 17 12:01:16 EST 2011 | qcman012856
Having issues with soldering bottom termination components such as PQFN's. Want to begin x-ray inspection to verify wetting. Wondering about soldering acceptablility criteria?
Electronics Forum | Tue Sep 18 10:29:21 EDT 2012 | davef
Sorry. I don't see any solder balls. To me, it looks like the solder wetted the pad and then pulled back. It's called dewetting. It's a defect. Ask your supplier for a SEM analysis. I'm interested to know what he / she says.
Electronics Forum | Fri Feb 15 16:56:46 EST 2013 | davef
I'll throw my hat in the ring that says, "At least 95% of the pads must be properly wetted." BR, davef
