Electronics Forum | Sat May 30 11:42:44 EDT 2020 | stephendo
At the same time ask for the technical data sheet and the Safety Data Sheet. You don't know what other auditors you may have to deal with in the future. And someone should have all the SDS's in a binder for all the chemicals that you use.
Electronics Forum | Thu Sep 09 19:32:12 EDT 2021 | kumarb
Forgot to ask earlier - what is the TG rating for your laminate? If not selected already, use a high TG rating like TG155 or TG170 laminates for the ROHS temps. Never saw swollen PCBAs with such rated PCBs to date.
Electronics Forum | Tue Sep 07 15:23:20 EDT 2021 | majdi4
1 ) Component is not Rohs : Material analyzes confirm that they contain lead over than < 1000ppm 2 ) upper piston blocked after reflow 3 ) wetting was unstable and slow due to heat transfer will you produce with ??
Electronics Forum | Mon Dec 06 18:28:24 EST 2021 | emeto
What is your current paste coverage? You mentioned windowpane and you mentioned 5mil stencil. You did not mention if PAD design meets recommendation? If it does, go 6mil and more paste coverage to increase volume.
Electronics Forum | Mon Dec 06 19:30:23 EST 2021 | duchoang
OSP finish is the big issue here. You almost can not get 100% coverage solder on OSP with 1 over 1 aperture stencil. Reconsider solder coverage requirement in this case. Check your peak temp in profile may help a little.
Electronics Forum | Tue Dec 07 07:57:09 EST 2021 | jineshjpr
Hi DWL, Thanks for your quick response. Let Me revert back once of all your feedback are answered. Manufacturer / Stencil / Solder Paste.
Electronics Forum | Tue Dec 07 07:59:36 EST 2021 | jineshjpr
Hi Evtimov, Thanks for your response - Coverage of Paste on the pad is 85 % (By considering window & outer area), Let me revert back after PAD design vs Recommendation verification.
Electronics Forum | Tue Dec 07 08:01:40 EST 2021 | jineshjpr
Hi DucHoang, Thanks for your response - Understanding that OSP will have more surface resistivity which does not allows the solder to flow on the entire pads. Let me check peak & revert back sooner.
Electronics Forum | Tue Dec 07 14:15:18 EST 2021 | majdi4
Hello Jinesh , if you can provide us with component datasheet , stencil design vs PAD design (GBX) and the thermal profil you use.. It would help us to found out the issue and help you.
Electronics Forum | Mon Dec 27 05:01:03 EST 2021 | jineshjpr
Hi JSeewald, You are very much right that there is difference between the solder pad with respect to IC pad. Since the Manufacturer suggests the same -- design also freezed to recommended dimensions.
