Electronics Forum | Wed May 10 00:27:46 EDT 2006 | Chris
Russ, By a longer profile you mean a more even slope across the entire profile. Unfortunately I only have a 5 zone oven that is fairly short. How many heated zones are you using? Did you shrink the 0402 pad design and leave less pad exposed out a
Electronics Forum | Tue Jun 20 10:15:44 EDT 2006 | samir
Again, the verdict is mixed here as well, but from the seminars, white papers, etc. the consensus seems to be that Pb BGA's are not compatible in a Pb-Free RoHS Process...but... Pb-Free SAC BGA's are compatible in a Sn-Pb process as long as your pro
Electronics Forum | Tue Sep 04 10:48:49 EDT 2007 | lloyd
How do other people check their solder joint strength after a process change? For example, say you are getting wetting problems and you feel that a change to the reflow profile may help, or perhaps a slight change to the stencil aperture to reduce so
Electronics Forum | Mon Aug 18 11:20:08 EDT 2008 | pjc
Stencil apertures are cut to deposit solderpaste onto the annular ring, provided its wide enough. Then you can place a solder preform if needed to ensure there is enough solder to fill the barrel. Here is some information on solder preforms: http://
Electronics Forum | Mon Dec 20 22:41:42 EST 2010 | grantp
Hi, We had it for a while, but had to take it out and replace it with normal convection. I mean the soldering quality is absolutely amazing, and the joints looked perfect, however it was a horror for tomb-stoning. We tried all types of stencil apert
Electronics Forum | Fri Feb 01 19:07:57 EST 2013 | hegemon
We have had some success in void reduction with LGA by pre-tinning or "bumping" the devices before placement. The extra solder seems to allow a slightly higher standoff, and allows better outgassing, is my guess. A lot more labor , but the results
Electronics Forum | Thu Jun 02 22:40:13 EDT 2016 | slouis2014
Hi, yes have a few experiments initially i tried to increase the solder volume but component pin have insufficient solder. 1. The solder coverage do you calculate it by solder volume or solder area. 2. if i would achieve as you recommend 50-60 % woul
Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Fri Nov 30 08:53:17 EST 2007 | jaimebc
Shy, Our 5 and 6 mils stencils have home plate apertures and reduced by 10% and using SMT adhesive. Never had a problem with components non wetting like you have. I do believe that you are not screening enough paste, something about the dog bone ape
Electronics Forum | Fri Apr 13 10:13:30 EDT 2007 | Bob R.
We had a crisis with one BGA causing huge yield losses due to this defect. Nothing we could do with the profile got rid of it. Changing paste didn't get rid of it. It was the BGA warping in reflow, caused the corners to lift up when the solder was
