Electronics Forum | Fri Aug 28 11:14:46 EDT 1998 | Justin Medernach
| General Question to anyone. If you were to go out and build the ideal stencil for pasting boards, what would be the best way to build a stencil? I have some boards that have 19.7 mil pitch parts and the pad width is 10 mil. The length of the pa
Electronics Forum | Tue Mar 13 14:17:00 EST 2001 | blair
Thanks a lot for the response 1) there are 8 BGA on this board 6 PBGA, 1 TBGA and 1 ESBGA (metal lid). They are dispersed over the board (approx 11"* 14") 2) Is there a tool to use to understand pitch/bump size and stencil aperture (optimized)? 3) Y
Electronics Forum | Tue Sep 14 10:25:37 EDT 1999 | Earl Moon
| I'm hoping to use 0201 caps and resistors in a new design but so far have only found one company who makes such small devices (Murato). | | Can anyone direct me to any other supplier? | | Are there any particular problems associated with using s
Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies
Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi
Electronics Forum | Sat Nov 14 14:12:39 EST 1998 | smd
| | | Scott: Where is the problem? When you have a board in one hand and a sheared ferrite in the other, what does the ex-ferrite location look like: | | 1 Green mask colored, because the pad is "ripped off" the board | 2 Gray lumpy looking, be
Electronics Forum | Tue Mar 17 09:06:25 EST 1998 | Justin Medernach
| | Hi all, | I would like to have some information regarding the paste in holes process.We are the Backplane manufacturing and dealing with lots of thick PCB and would like to change the processes from wave to paste in hole.Any feed back of info
Electronics Forum | Wed Jan 16 07:49:14 EST 2002 | Yannick
Hi, In few weeks I want to test the capabilities of our SMT Line. To do that I'll design a board. I want to test: - The Printing - The component placement - The soldering - Different stencil aperture - Mixed Technology (Thr
Electronics Forum | Sun Sep 15 15:08:00 EDT 2002 | jersbo
My 2 cents... Screen printing may very well have a leg up on deciding SMT defects... however if you pay attention to your stencil (aperture size ratio etc..) and inspect your prints... I believe its a much lesser number... (paste MFG also plays a ro
Electronics Forum | Mon Feb 21 02:02:54 EST 2005 | JSS
First of all THANKS for thr reply. I totally agree with u that paste dried,stencil aperture clogged like probs comes during the production but we hv a visual inspection stage (with 5X illuminated lamp)after printing process and before inserting the
Electronics Forum | Wed Mar 02 05:14:07 EST 2005 | ABHI
Guys, Solder paste height worries all of us as we encounter the non wets after reflow. More so in fine pitch QFP's. The non wets are not always caused by solder paste height. Many other contributors. Even the pad geometry on te board can contribute t
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