Electronics Forum: stencil apertures (Page 45 of 121)

Stencil design question.(BGA Apertures)

Electronics Forum | Mon Apr 03 07:46:21 EDT 2006 | cyber_wolf

I have a pad layout that has .010" dia. with .010" spacing. Going to use a .004" foil. I know I need to over print them, but how much without causing bridging issues ? Thanks, Sr.

Stencil design question.(BGA Apertures)

Electronics Forum | Tue Apr 04 14:00:48 EDT 2006 | russ

I have used a .013" square under these conditions. Limited run but all were good. 72 qty in 1 batch run

Screen cleaner evaluation

Electronics Forum | Mon Feb 04 11:56:39 EST 2008 | aj

Hi all, what sort of magnification is fair to use when evaluating a stencil cleaner i.e. apertures. aj...

Pin in Paste assistance

Electronics Forum | Thu Dec 17 16:02:41 EST 2020 | proceng1

I think over printing is the best option, and I like the idea of ordering a test stencil with increasing sized apertures. Make sure you go beyond what you think will work, just so you know where line is.

via in pad

Electronics Forum | Fri Oct 18 22:32:20 EDT 2002 | mdm4ua

If you have room try putting a small piece of tape on the bottom of the stencil right next the aperture that is giving you the problem. The added height of the tape (Kapton tape is usually about 3 mils thick) will likely give you a heavy enough depo

BGA Aperture

Electronics Forum | Wed Jun 20 08:14:36 EDT 2007 | pavel_murtishev

Good afternoon, You should use overprint technique if you have any problems with paste volume (PIH technology and mixed designs, for instance). Otherwise, it is useless. Overprint has to be made in such way so that paste would have an ability to flo

Stencil Design

Electronics Forum | Wed Jun 03 22:07:41 EDT 2009 | davef

= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the

Re: Home plate or bow tie?

Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll

I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o

Tilted/Slant SMT Component Specs?

Electronics Forum | Wed Mar 27 19:26:53 EST 2002 | ianchan

After a whole night's self review, I think we can term the slant/tilt as "floating 0805, yet end-terminals have acceptable solder joint formation". the width portion of the 0805 RES/CAP is (floating)elevated from the PCB pad, yet both (width) termin

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy

Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your


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