Electronics Forum: thermal management (Page 5 of 12)

Re: haloing on SMT PCBs

Electronics Forum | Mon Jun 08 15:00:08 EDT 1998 | Earl Moon

| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot

Re: Qualifying new PWB Vendors

Electronics Forum | Fri Jan 15 15:06:30 EST 1999 | Earl Moon

| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have

Re: Qualifying new PWB Vendors

Electronics Forum | Fri Jan 15 15:17:21 EST 1999 | Earl Moon

| | Hello, | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | So far, the tests I can think of performing, and tha

Reflow oven profiling - frequency ???

Electronics Forum | Fri Apr 27 11:01:36 EDT 2007 | pjc

Profiling is product specific. An instrument called the OvenRIDER from ECD is for soldering machine quality management. See link below. This instrument measures various parameters of your oven to include thermal transfer efficiency. The concept is,

PCB bows after wave soldering

Electronics Forum | Fri Jun 18 17:36:10 EDT 2010 | sid

Good afternoon all, I have been trying to find a solution to a defect I just noticed. After stencil printing and smt part placement on the secondary side of my boards, I run them through a wave soldering system. All my components got soldered perfe

Re: Calibration

Electronics Forum | Thu Jun 25 18:17:26 EDT 1998 | Earl Moon

| What is the industry standard for calibration compliance certification of SMT machines? and Flow Solder machines? | We are currently doing a Quality Audit on one of our manufacturing venders and this questions has been brought up. | Any help would

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon

| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe

Re: Reflow soldering a Flexi-Rigid pcb

Electronics Forum | Sun Apr 05 09:46:47 EDT 1998 | Earl Moon

| We are looking at reflow soldering some Flexi-rigid | pcbs. I have heard that IR reflow soldering can make the Polyimide "self heat" and cause de-lamination. | Does anyone have any info. The thermal problems associated with polyimide rigid/flex de

Re: Bga reballing

Electronics Forum | Mon Jul 26 15:25:27 EDT 1999 | APE South, Jack Reed, Asian Sales Administrator

Dear Mr. Park, Ahn yahn haseo and good day to you. If you are currently in Korea, APE has a direct representative there, Omni-Create in Seoul who can give you full information on BGA reball kits available. Essentially, reball kits are custom made t

Re: Reflow Profiling

Electronics Forum | Tue Dec 01 14:44:04 EST 1998 | Terry Burnette

| Hi | I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the


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