Industry News | 2018-05-18 15:47:55.0
As chips and packages become more complex, and installed in harsher conditions such as automobiles, the thermal conductivity of underfill materials becomes a greater concern. What can be done to prevent decreased reliability due to thermal dissipation issues?
Industry News | 2016-03-30 09:04:09.0
Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Industry News | 2010-11-09 19:19:27.0
Krayden, Inc. debuts Dow Corning’s 3-6751 Thermally Conductive Adhesive used for bonding heat sinks to electronic devices and PCBs to substrates.
Industry News | 2013-09-05 20:26:22.0
Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.
Industry News | 2020-12-29 19:40:56.0
Amfas State-of-the-Art Casting Alloys for High Strength and High Thermal Conduction Designed for Electronics Applications
Industry News | 2012-02-15 19:12:30.0
Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.
Industry News | 2016-03-03 08:45:28.0
Henkel Adhesive Technologies today announced an addition to its line of Bergquist Liqui-Form® Thermal Interface Materials (TIMs) with the market introduction of Liqui-Form 3500. A one-part, thermally conductive, liquid formable gel, Liqui-Form 3500 combines high thermal conductivity with process flexibility and excellent reliability.
Industry News | 2015-07-28 18:30:09.0
HBC-SD49 Hybrid Benchtop Chamber Combines Thermal Conduction & Convection in one incredibly fast and efficient design TotalTemp Technologies offers a better way to do Thermal Testing. The first true Hybrid Temperature Chamber/Platform combination called the Hybrid Benchtop Chamber. The floor of the temperature chamber is a Hot/Cold Plate that can be controlled in conjunction or independently.
Industry News | 2021-04-15 12:14:33.0
At Indium Corporation, we believe that materials science changes the world. In recognition of the notable material behind our name, we will release monthly installments of the Elements of Indium Series--an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49th element.
