Electronics Forum | Wed Feb 10 18:26:04 EST 1999 | Earl Moon
| Has anyone had any experience in using SMT to mount an organic (FR-4, Getek) rider card onto an organic (FR-4, Getek) mother board? By SMT I mean the attachment of the rider card would be through pads directly to pads on the mother board. | | Than
Electronics Forum | Sat Jan 23 07:08:54 EST 1999 | Graham Naisbitt
| I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the c
Electronics Forum | Thu Sep 10 21:48:37 EDT 1998 | Dave F
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Sat May 30 18:09:17 EDT 1998 | Earl Moon
| Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | As everyone knows, IBM had problems with their ceramic BGA
Electronics Forum | Mon Jun 01 20:37:54 EDT 1998 | D.Lange
| | Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | | As everyone knows, IBM had problems with their ceramic
Electronics Forum | Fri May 15 09:07:12 EDT 1998 | Earl Moon
| | I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and event
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Wed Jun 15 13:40:49 EDT 2011 | hegemon
I have seen this before with larger PBGA components. When installed using a rework system, I would advise Convective rather thn IR. In my experience having high power (not high temp) convection is the only way to deal with these problematic devices
Electronics Forum | Tue Oct 11 11:54:36 EDT 2011 | Shean Dalton
There are aerosol spray on flux removers that contain Trichloroethylene. There are also many other flux removers on the market. Recommend you explore more options. To help get an answer quickly, you can contact Zestron, Kyzen, Petroferm, etc; an
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
