Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
New Equipment | Curing Equipment
Flexible - Multi-wave-length Arc-lamps cures most coatings and glues without the need of changing lamps. Compact - Overall length of only 1600 mm, including -Inspection module -Dual Arc lamp ramps and cooling zone. Energy efficient - Energy consump
New Equipment | Solder Materials
FCT Solder has positioned itself as a leader in lead-free solder products. As a licensee of Nihon Superior’s patented technology, we manufacture and sell the leading lead-free alloy, SN100C. FCT Solder is the original licensee of Nihon Superior’s tec
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
New Equipment | Solder Materials
DKL Metals have recently introduced their latest generation of Partner Paste formulations which have been designed specifically for use in Lead Free soldering. These pastes all give excellent print and reflow characteristics, tack life and stencil li
Patented PEM® R’ANGLE® fasteners for thin metal assemblies and printed circuit boards create strong right-angle attachment points to enable tighter design control, reduced hardware counts, and associated production economies. This family of fastener
Industry News | 2018-09-07 16:52:18.0
Kester is proud to announce the launch of WP616, a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP616 provides a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation. WP616 is a stable water-soluble formula, providing consistent stencil life, tack time and print definition.
