Electronics Forum | Fri Feb 05 02:40:40 EST 2021 | victorzubashev
For components with the large pads, you can also use secondary soldering dispensing. Some printers like DEK have an option to mount a syringe with an auger valve to do dispensing after the printing step process. Obviously will not work if you have to
Electronics Forum | Fri Mar 09 15:13:49 EST 2012 | davef
Care must be taken to not apply an excess of material, as the adhesive will flow under the device during placement and curing, and could cause a short. Printer setup: * Don't worry about stencil thickness. A wide range of stencil thicknesses (typic
Electronics Forum | Tue Oct 13 18:03:40 EDT 1998 | Sanjay Bhatikar
Sirs, What are the issues involved when a stencil printer is used for printing solder paste and adhesive? UV-curing of adhesive appears to help reduce slump and spread by forming a tough skin on the adhesive blob deposited on the PCB. Is th
Electronics Forum | Wed May 17 13:48:37 EDT 2006 | dwelch123
I'm having trouble printing leads on a fine pitch part. The lead is only .008". I'm using a DEK 265 with metal squeegee and using WS200 multicore solder paste.The stencil is laser cut and polished. I've experimented with different pressures and diffe
Electronics Forum | Tue Sep 21 13:43:33 EDT 1999 | Glenn Robertson
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Tue Oct 31 03:50:20 EST 2000 | JohnW
Honda, Prnting Glueisn't as difficult as it sounds, as long as you have the right stuff and a good set up. It also depend's on what your going to be placing. If your just doing 0603, 0805 and 1208 than you really only need an 8 thou or 10 thou stenc
Electronics Forum | Tue Jun 28 13:04:08 EDT 2005 | slthomas
Are you saying that increasing the frequency of cleaning to every 3 boards *reduced* bridging, or that it's just something you tried? I don't understand why that would help(in my experience it has reduced "insufficient solder" conditions but not brid
Electronics Forum | Tue Oct 31 01:08:25 EST 2000 | Dreamsniper
Here are some: Printing Speed : 2.5 ips (inch per sec) Stencil Thickness: 10 - 12 mil but the latter is the best. Dots sizes: u can get that from the Forum Archive...I used Dave F's dot sizes recommendation...they are good! Squeegee Blade : use met
Electronics Forum | Sat Jun 25 00:52:31 EDT 2005 | ktron
Hi all, Recently I had problem with printing the lead free solder paste, almost every board has bridging especially on the fine pitch locations. Anyway this problem never happens when we use leaded solder paste. So I would like to ask if there are a
Electronics Forum | Wed Dec 17 09:55:10 EST 2008 | jorge_quijano
Hi to everyone, I will be runnig product with adhesive with a MPM UP2K, I'll use a 0.020" stepped stencil & metal blades. Is it better to use high speed for print head travel? more/less squeegee force than with solder? slow snap off? what could you r
