Industry News | 2015-04-22 14:52:28.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Test Instruments for Camera Assist Automatic Bondtesting on the 4000Plus. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. This is the fourth award for this application.
Industry News | 2014-10-01 13:08:36.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2014 Global Technology Award for its Camera Assist Automatic Bondtesting.
Industry News | 2014-08-28 15:48:58.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, Director of Applications, will present two papers at the upcoming SMTA International exhibition.
Technical Library | 2020-07-02 13:29:37.0
Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.
Industry Directory | Consultant / Service Provider / Manufacturer
The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.
Industry News | 2016-04-04 09:33:43.0
Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.
Industry News | 2017-08-03 06:15:05.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event.
Standard Printed Circuit Boards custom manufactured over 1,000 double-sided, high-temperature printed circuit boards (PCBs) for a client from the Telecom/IT Industry. These PCBs are capable of withstanding continuous operating temperatures of 250° Ce
Industry News | 2017-10-17 19:47:15.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Hall A2 Booth 445 at productronica 2017, scheduled to take place Nov. 14-17, 2017 at the Messe München in Germany.
New Equipment | Test Equipment - Bond Testers
The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Full automation, 0.075% accuracy, best ergonomics, highest throughput, vision options,
