Electronics Forum | Wed May 07 09:21:46 EDT 2003 | davef
Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�;
Electronics Forum | Fri Mar 19 11:48:06 EST 2004 | Ken
This is the dilema during this transition period. Here is a tip: If you see typcial solder joints on a lead free process, but only on one component type....it probably has a significant quantity of lead in it (ex. Sn90/Pb10...and so on) If using T
Electronics Forum | Fri Nov 13 14:35:29 EST 1998 | Dave F
| Anyone using SMT "Fair-Rite" beads? We have a P/N 2743019447 that we're using. We need to know the shear force strength of the part and the vendor's man who knows is in Deutschland and can't help until Monday. I can't wait that long. | | Also, do
Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul
We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba
Electronics Forum | Fri Oct 01 10:04:20 EDT 1999 | Andrew William Dalrymple
I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at rewor
Electronics Forum | Tue Oct 16 07:00:06 EDT 2001 | genglish
Hi all, I have a problem and would gratefully take on suggestions, firstly let me explain the situation: We are currently screen printing adhesive, using a method similar to DEKs 'Pump Print', The adhesive we are currently using is supplied from Alp
Electronics Forum | Wed Apr 07 22:15:31 EDT 2004 | davef
We're not familiar with the AUG5 from Taiyo. [It doesn't show on their US site.] Is it liquid photoimageable? Printed solder masks are more likely to bleed. But you wouldn't have any solderability with bleed. Your plating seems acceptable [if th
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Tue May 26 13:01:40 EDT 1998 | Earl Moon
| Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint st
Electronics Forum | Wed Oct 27 11:32:57 EDT 1999 | Brian W.
When I evaluated a new glue type, I simply used a shear force tester (Chatillon) to compare the cured strengths of the different glues. I sampled parts of different types; 0805, SOT23, 1206, and various tantalum caps. I analyzed the data based on e
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