Industry News: sac305 (Page 5 of 17)

SHENMAO to Showcase Advanced Automotive Electronic Solutions at 2024 IPC APEX EXPO

Industry News | 2024-03-18 12:35:19.0

SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.

Shenmao Technology Inc.

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Industry News | 2017-08-10 17:43:56.0

Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.

Nihon Superior Co., Ltd.

Gen3 System supplies the Nordson SELECT Novo 460 PD Selective Soldering System for Custom Interconnect Ltd’s production facility in Andover.

Industry News | 2018-08-06 05:59:56.0

Gen3 System supplies the Nordson SELECT Novo 460 PD Selective Soldering System for Custom Interconnect Ltd’s production facility in Andover. The Nordson SELECT Selective Soldering Systems have been honoured with prestigious awards for innovation and excellence. With over 25 years experience in electronics manufacturing they’re proven both a highly experienced and a devoted team to perform flawlessly tailored products.Nordson SELECT have risen to become the foremost worldwide supplier of Selective Soldering Systems.

Gen3 Systems

Nihon Superior to Introduce TempSave duringAPEX 2021

Industry News | 2021-02-12 16:08:40.0

Nihon Superior Co. Ltd is pleased to announce thatit will exhibit its newly developed TempSave series during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company also will showcase its NozzleSave alloyalong with SN100CV P608 and LF-C2 P608 solder pastes.

Seika Machinery, Inc.

Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Industry News | 2021-10-07 15:29:25.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #3301 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Industry News | 2022-01-03 07:24:21.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Industry News | 2022-10-06 18:19:54.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1230 at the SMTA International Exposition, scheduled to take place Nov. 2-3, 2022 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.

Nihon Superior Co., Ltd.

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Industry News | 2022-12-21 10:42:04.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.

Nihon Superior Co., Ltd.

Kester's Peter Biocca to Present at SMTA Atlanta 2009

Industry News | 2009-04-13 16:28:45.0

ITASCA, IL � April 2009 � Kester's Peter Biocca, along with Carlos Rivas of SMT Dynamics, will present a paper titled, �Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level,� at the upcoming 13th Annual Atlanta Expo scheduled to take place at 1 p.m. on Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Kester

Nihon Superior’s Keith Howell to Present at International Conference on Soldering and Reliability

Industry News | 2010-05-05 21:42:51.0

OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell will present a paper titled “Effect of Soldering Method and Flux Type on Whisker Growth in SAC305” at the upcoming International Conference on Soldering and Reliability (ICSR), which is co-located with the Lead-Free Academy and SMTA Toronto Expo and Tech Forum.

Nihon Superior Co., Ltd.


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