New Equipment | Rework & Repair Equipment
20 X 20 in. (508 mm X 508 mm) Min. Component Size 0.005" (0.12mm) Placement 0.0005" (12μ) mean + 3σ Compliance CE, ANSI/UL 61010, CAN/CSA C22.2 Top Heater 2.0 kW Site Heater 1.0 kW Bottom Heater 5.6 kW Field-of-View 2.6" (65 mm) Square Carry
PNC Inc. provides complete software development from low level embedded device driver to top level applications as well as interface protocols and security algorithms. Software Development Board support packages (BSP) Device drivers Operating s
New Equipment | Assembly Services
PCB Assembly HuanYu Future provides consigned assembly services for electronics manufacturers in small volume NPI format. We have procured seven lines of extremely high end SMT chipshooters, and with our own advanced management system, we build
New Equipment | Assembly Services
Qualitel is equipped and staffed to provide a wide array of assembly capabilities ranging from highly automated to purely manual. We constantly add new capabilities to support customer requirements. Most of our manufacturing employees are certifie
New Equipment | Education/Training
The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, c
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework). SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat
> Anchors-Fasteners >> Pool Cover Anchors Concrete Anchors BRASS ANCHORS FOR POOL COVERS CONCRETE ANCHORS FOR WINTER SAFETY COVERS FOR SWIMMING POOLS ACCESSORIES Brass anchors and C
Application Field SMT/PCBA Package type：BGA、LGA、CSP、POP、SIP... Defect type：Void、HIP、Insufficient、Bridge... Semiconductor Package type：W/B、IC、F/C... Defect type：Void、Open、Short、Sweep、Solder ball... Other areas
SCALABLE, COST-EFFECTIVE SOLUTION FOR HIGH-MIX & NPI Combines the capability, flexibility, and reliability you expect from Panasonic’s award-winning NPM and PanaCIM® Manufacturing Execution System (MES) into a cost-effective, high-mix solution. T
